Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Scientific Article | Ici, l’accumulation des ions cuivreux dans une solution en une expérience de modèle et d’une analyse fondée sur des mesures
Knowledge of the behavior of cuprous ions (monovalent copper ion: Cu(I)) in a copper sulfate plating bath is important for improving the plating process.

Copper electroplating fundamentals

Structure of 1:2 complex between Cu(I) and BCS chelate.

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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Copper Plating - an overview

CN101922027B - Cyanide-free alkaline copper plating solution and preparation method thereof - Google Patents

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution